Fujitsu thinks it's cracked the smartphone heating problem

Fujitsu's cooling solution might just pave the way for higher-grade internals for mobiles

With higher-end processors and even more memory being stuffed into smartphones, one issue has yet to really be addressed: cooling for smartphones. Fujitsu, though, thinks it might have a solution. It's a very thin loop heat pipe - think one millimetre - and capable of transferring about five times more heat than current heat pipes.

 

Cooler smartphones, literally

Higher-end components will generate more heat inevitably, thus a cooling solution is a requirement. There is no space inside a mobile phone for, say, large heatsinks or fans. Would be hard to talk if there's a fan whirring somewhere inside your phone now, wouldn't it?

Fujitsu's heat pipe has an evaporator that absorbs heat from components while a condenser then dissipates the heat away. A loop, filled with a coolant fluid, connects both the evaporator and condenser. The principle here is that the transferred heat evaporates the coolant, and the energy that went into evaporating the coolant is transferred away from the heat source, causing a lowering of temperature.

With the cooling tech, smartphone makers can then continue to use, say, octa-core processors without worrying about overheating as Fujitsu's solution helps prevent hotspots forming. Fujitsu is looking at how else the technology can be used in other devices besides smartphones.

[Source: Fujitsu via The Register]